Wave solder process characterization by an experimental design approach

Abstract

A manufacturing company in Puerto Rico was interested in evaluating the possibility of profiling all printed circuit board assemblies. Experimental design, a method for systematically planning engineering studies, offered the means to accomplish this possibility while at the same time it helped to optimize the profiling process. Just before this project took place, profiles of all product transfer made at the plant were the same. Further defect reduction could not be obtained with current machine settings. However, a new NU ERA wave solder machine offered many possibilities for improvement. In this paper we discuss the experimental design that took place at the plant and we are able to identify the important factors which contribute to the response of the profiling process and to determine which factor settings will produce the best profilings.