Parallel Plates Internal Heat Transfer Analysis for Electronic Cooling

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dc.contributor.advisorRestrepo Torres, Bernardo
dc.contributor.authorMeléndez Colón, Alex R.
dc.date.accessioned2020-10-13T15:07:57Z
dc.date.available2020-10-13T15:07:57Z
dc.date.issued2013
dc.descriptionDesign Project Article for the Graduate Programs at Polytechnic University of Puerto Ricoen_US
dc.description.abstractTwo-dimensional heat transfer analysis using the Integral Equation Method between a series of parallel plates with uniform surface heating to determine the Temperature Distribution as a Thermal Model for a Supercomputer cluster arrangement at the Department of Electrical Engineering of Polytechnic University of Puerto Rico was developed. The Temperature and Velocity Profiles across the arrangement were measured and analyzed. KeyTerms-Forced Convection Heat Transfer, Parallel Plates, Temperature Distribution, Turbulent Flow.en_US
dc.identifier.citationMeléndez Colón, A. R. (2013). Parallel plates internal heat transfer analysis for electronic cooling [Unpublished manuscript]. Graduate School, Polytechnic University of Puerto Rico.en_US
dc.identifier.urihttp://hdl.handle.net/20.500.12475/845
dc.language.isoen_USen_US
dc.publisherPolytechnic University of Puerto Ricoen_US
dc.relation.haspartSan Juanen_US
dc.relation.ispartofMechanical Engineering;
dc.relation.ispartofseriesSpring-2013;
dc.rights.holderPolytechnic University of Puerto Rico, Graduate Schoolen_US
dc.rights.licenseAll rights reserveden_US
dc.subject.lcshHeat--Transmission
dc.subject.lcshElectronic apparatus and appliances--Cooling
dc.subject.lcshPolytechnic University of Puerto Rico--Graduate students--Research
dc.titleParallel Plates Internal Heat Transfer Analysis for Electronic Coolingen_US
dc.typeArticleen_US

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