Neuromodulation Leads Yield Fallout Improvement due to Fallen Segment

Abstract

Neuromodulation Leads used for Deep Brain Stimulation (DBS) is an elective surgical procedure in which electrodes (that generates electrical impulses that control abnormal brain activity) are implanted into certain brain areas. The leads consist in Ring Electrodes and a combination of Ring and Segmented. The electrodes are welded to the conductive wires using Resistance Welding technology. Epoxy adhesive is used at the electrode arrays to hold the electrodes in place and to provide stiffness for lead handling during implant. After each Epoxy Adhesive bonding process, the leads are Grinded to reduce the outside diameter. A failure is observed at the grinding process of the distal electrodes arraywhen the segment electrodes detached from the assembly. An increase in Yield Fallout was observed during the implementation of a new Epoxy Adhesive. The objective of this project is to improvethe yield performing a Resistance Welding Study that is expected to reduce the electrode detachment. Key Terms- Epoxy Adhesive; Grindingprocess; Resistance Welding; Yield fallouts.