Optimization of the Heat Bonding Process for Pacemaker Leads: Conceptual Design and Finite Element Analysis

dc.contributor.advisorPeláez Carpio, Hugo
dc.contributor.authorRodríguez Vargas, Wilyim
dc.date.accessioned2025-07-22T14:23:40Z
dc.date.issued2025-05
dc.descriptionDesign Project Article for the Graduate Programs at Polytechnic University of Puerto Rico
dc.description.abstractThis project aims to optimize the heat bonding process used in the manufacturing of pacemakers and leads to bradycardia treatment by redesigning the thermal assembly to improve temperature uniformity, process efficiency, and structural alignment. The original system, which used a dual-stage heating process and an INVAR 36 [1] bar with copper inserts, exhibited significant thermal gradients and misalignment due to thermal expansion. To address this, a new design was developed incorporating Celazole [2] thermal insulators. Finite Element Analysis (FEA) [3]F was performed to evaluate thermal behavior. The updated thermal architecture significantly improved temperature consistency across all bonding zones, with improved control and efficiency. Keywords - Celazole, FEA (Finite Element Analysis), INVAR, Thermal Control.
dc.identifier.citationRodríguez Vargas, W. (2025). Optimization of the Heat Bonding Process for Pacemaker Leads: Conceptual Design and Finite Element Analysis [Unpublished manuscript]. Graduate School, Polytechnic University of Puerto Rico.
dc.identifier.urihttps://hdl.handle.net/20.500.12475/3081
dc.language.isoen
dc.publisherPolytechnic University of Puerto Rico
dc.relation.haspartSan Juan
dc.relation.ispartofMechanical Engineering Program
dc.relation.ispartofseriesSpring-2025
dc.rights.holderPolytechnic University of Puerto Rico, Graduate School
dc.rights.licenseAll rights reserved
dc.subject.lcshPolytechnic University of Puerto Rico--Graduate students--Research
dc.subject.lcshPolytechnic University of Puerto Rico--Graduate students--Posters
dc.subject.lcshPolytechnic University of Puerto Rico--Subject headings--Unassigned
dc.titleOptimization of the Heat Bonding Process for Pacemaker Leads: Conceptual Design and Finite Element Analysis
dc.typeArticle
dc.typePoster

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